秒速赛车最新开奖号码
| Process | Description | Dimension Min. um (mils) |
| Glob Top | Overlap of Encapsulation to Wire Bond on PCB, substrate or package | ≥600um (24 mils) |
| Glob Top or Dam & Fill | Overlap of Encapsulation to Top of Wire Bond Loop | ≥200um (8 mils) |
| Glob Top or Dam & Fill | Space Fiducial to Glob Top or Dam | ≥300um (12 mils) |
| Glob Top or Dam & Fill | Fiducial Size (3x Round Pad) | ≥300um (12 mils) |
| Dam & Fill | Space Wire Bond Pad edge to Dam | ≥200um (8 mils) |
| Dam & Fill | Dam Width minimum | ≥400um (16 mils) |
| Dam & Fill | Dam Height maximum * (2x Dam Width using Tall Dam material) |
≤800um (32 mils) * |
秒速赛车开奖预测
- Glob top is a one-part process for small-medium die with wire bonds.
- Glob top with rigid black encapsulant for high reliability applications.
- Glob top with flexible UV light and moisture cure for clear encapsulant.
- Dam & Fill is a two-part process for large die with wire bonds.
- Underfill dispensing for CSP and Flip Chip components.
- Die-Attach epoxy dispensing: conductive and non-conductive.
