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秒速赛车开奖结果
- Gold Ball Wire Bonding (Thermosonic @ +150°C).
- Gold Wedge Wire Bonding (Thermosonic @ +150°C).
- Aluminum Wedge Wire Bonding (Ultrasonic @ +25°C).
- Ribbon Bonding for high frequency applications 20-100 GHz.
秒速赛车计划5码一期
- ENEPIG, IPC-4556: Electroless Ni/ Electroless Pd/ Immersion Au.
| IPC-4556 | ENEPIG | SMT and Gold Wire Bonding |
| 3rd level | Gold | ≥0.1 um (≥ 4 uinches) Immersion Gold |
| 2nd level | Palladium | 0.05 – 0.30 um (2 – 12 uinches) Electroless Palladium |
| 1st level | Nickel | 3-6 um (118 – 236 uinches) Electroless Nickel |
- ENIG, IPC-4552: Electroless Ni/ Immersion Au.
| IPC-4552 | ENIG | SMT and Aluminum Wire Bonding |
| 2nd level | Gold | ≥0.05 um (≥ 2 uinches) Immersion Gold |
| 1st level | Nickel | 3-6 um (118 – 236 uinches) Electroless Nickel |
秒速赛车官方网址
| Description | Design Guideline |
| PCB Bond Pad Size (Preferred) | ≥ 100 x 300um (4x12mil) |
| PCB Bond Pad Size (Minimum) | ≥ 100 x 250um (4x10mil) |
| PCB Pad Pitch | ≥200um (8mil) |
| PCB over-etching (Maximum) | ≤10% (min. bond pad width 90um) |
| Solder mask clearance on bond pad | ≥ 200 um (8mil) |
| Solder mask opening on bond pad | BPL + 400 um and BPW + 400 um |
| Solder mask thickness | LPI ≤ +/-25um; LDI ≤ +/-15um |
| Solder mask alignment tolerance | LPI ≤ +/-50um; LDI ≤ +/-30um |
秒速赛车网上
- Gold Ball or Gold Wedge Wire Bonding, Thermosonic @ +150°C.
- 20um (0.8mil), 25um (1.0mil) and 32um (1.25mil) wire diameter standard.
| Wire Diameter Size um (mil) | Wire Length (mm) | IC Bond Pad um(min) |
IC Pad Pitch um(min) |
Staggered Pitch um(min) |
| 18um (0.7mil) * | ≥0.3≤2.7mm | ≥35um | ≥45um | 23/46um |
| 20um (0.8mil) | ≥0.3≤3.0mm | ≥45um | ≥55um | 28/56um |
| 25um (1.0mil) | ≥0.3≤3.75mm | ≥55um | ≥65um | 33/66um |
| 32um (1.25mil) | ≥0.4≤4.8mm | ≥70um | ≥90um | 45/90um |
| 38um (1.5mil) * | ≥0.5≤5.7mm | ≥90um | ≥110um | 55/110um |
秒速赛车现场开奖直播
- Aluminum Wedge Wire Bonding, Ultrasonic @ +25°C.
- 20um (0.8mil), 25um (1.0mil) and 32um (1.25mil) wire diameter standard.
| Wire Diameter Size um (mil) | Wire Length (mm) | IC Bond Pad um(min) | IC Pad Pitch um(min) |
Staggered Pitch um(min) |
| 18um (0.7mil) * | ≥0.3≤3.6mm | ≥45um | ≥55um | 28/56um |
| 20um (0.8mil) | ≥0.3≤4.0mm | ≥55um | ≥65um | 33/66um |
| 25um (1.0mil) | ≥0.3≤5.0mm | ≥65um | ≥75um | 38/76um |
| 32um (1.25mil) | ≥0.4≤6.4mm | ≥80um | ≥100um | 50/100um |
| 38um (1.5mil) * | ≥0.5≤7.6mm | ≥100um | ≥120um | 60/120um |
秒速赛车历史走势图
| Destructive Bond Pull Test | Wire Size um (mil) | Gold min.gm force | Aluminum min.gm force |
| Double Bond | 18um (0.7mil) | ≥2.0 | ≥1.5 |
| Double Bond | 20um (0.8mil) | ≥2.5 | ≥2.0 |
| Double Bond | 25um (1.0mil) | ≥3.0 | ≥2.5 |
| Double Bond | 32um (1.25mil) | ≥4.0 | ≥3.0 |
| Double Bond | 38um (1.5mil) | ≥5.0 | ≥4.0 |
秒速赛车全天一期计划
| Description | MIL-STD-883, TM2017 Bond Visual Inspection 30x to 60x magnification |
|
| Inspect | Ball Bond | Wedge Bond |
| Bonds on Die, PCB or Package |
Gold Ball Gold Crescent |
Aluminum Wedge (Foot) Bond Width: 1.2x to 3x wire diameter Bond Length:1.5x to 3x wire diameter Bond Tail: ≤2x wire diameter Gold Wedge (Foot) Bond Width: 1.5x to 3x wire diameter Bond Length:1.5x to 3x wire diameter Bond Tail: ≤2x wire diameter |
秒速赛车走势软件
| Wire Dia. um (mil) | Gold 4N | Al, 1%Si | Gold 4N | Al, 1%Si |
| Resistance Ω(mm²)/m | 0.0222 | 0.0278 | Length ≥1mm | Length ≥1mm |
| DC Resistance Ohm/m | Burn-out current, Amps | |||
| 18um (0.7mil) | 88.03Ω/m | 104.33Ω/m | 0.38A | 0.21A |
| 20um (0.8mil) | 71.30Ω/m | 84.50Ω/m | 0.46A | 0.30A |
| 25um (1.0mil) | 45.63Ω/m | 54.08Ω/m | 0.63A | 0.47A |
| 32um(1.25mil) | 27.85Ω/m | 33.01Ω/m | 0.91A | 0.68A |
| 38um (1.5mil) | 19.75Ω/m | 23.41Ω/m | 1.17A | 0.88A |
