秒速赛车结果

AmTECH Microelectronics, Inc. was established in 1993 by a core team of Silicon Valley professionals. The team’s roots coming from Design and Process Engineering of PCB Assembly, Hybrid Circuits, Multi-Chip Modules, Chip-On-Board and Chip-On-Flex. These technologies are used to create products incorporating SMT, Micro-SMT, Flip Chip & Underfill, Die Attach, Wire Bonding, Ribbon Bonding and Dispense & Encapsulation manufacturing processes.

AmTECH’s teamwork experience started in the early 1980’s designing and manufacturing hundreds of these electronic devices,  combining multiple materials, components, assembly technologies and manufacturing processes on Rigid, Flex, Rigid-Flex PCB and Ceramic substrates.

AmTECH’s “hands-on” Engineering team, skilled manufacturing Technicians and experienced assembly Operators solve manufacturing challenges and accelerate time-to-market for each product we assemble. These products require high levels of value-added engineering, laser-focus attention to detail, and state-of-the-art automated equipment.

• Complex PCB Assembly: Full automation for SMT, Micro-SMT, Flip Chip and Underfill.
• Advanced Microelectronics: Full automation for Die Attach, Multi-Chip, Wire Bonding and Encapsulation.